Thomas Sci Co., Ltd

manufacturer(20)

Showing 11 - 20 of 28, total 3 pages [First] [Previous] [Next] [Last]

led epitaxial wafer encapsulation adhesive
Specification: THO4098
Detail: Name High temperature resistant adhesive£¨THO4098£© Outline It is heterocyclic adhesive which cures fast when heated. it is temperature resistant and easy to operate. No bubbles appear after curing thus making the surface smo...

fiber glass high temperature resistant adhesive
Specification: THO4057
Detail: Name High temperature resistant adhesives for bonding glass £¨THO4057£© Outline Being high temperature resistant, this double-component product is acrylic acid polyester adhesive. It is easy and convenient to use for it solid...

fire retardant adhesive
Specification: THO4072
Detail: Name High temperature resistant flame retardant adhesives £¨THO4072£© Outline This double-component product is acrylic acid polyester adhesive. It is easy and convenient to use for it solidifies fast at normal temperature and...

thermally conductible adhesive
Specification: THO4074
Detail: Name Thermally conductive adhesives£¨THO4074£© Outline This single-component product is acrylic acid polyester adhesive. It is easy and convenient to use for it solidifies fast at normal temperature and bonds well. Being stab...

moisture resistant adhesive
Specification: THO4095-II
Detail: Name High temperature and humidity resistant adhesive£¨THO4095-II£© Outline It is heterocyclic adhesive which cures fast when heated. it is temperature resistant and easy to operate. No bubbles appear after curing thus making...

fast curing high temperature resistant adhesive
Specification: THO4073
Detail: Name High temperature resistant fast curing adhesive£¨THO4093-I£© Outline It is heterocyclic adhesive which cures fast when heated. it is temperature resistant and easy to operate. No bubbles appear after curing thus making t...

metal infiltrative adhesive
Specification: THO4073
Detail: Product name High temperature resistant infiltrating adhesive£¨THO4073£© Outline This one-component strain modified epoxy adhesive cures fast when heated, it is temperature resistant and easy to operate. Applications It is ...

electronic components potting adhesive
Specification: THO4054
Detail: Name High temperature resistant adhesives for the encapsulation of electronic components £¨THO4054£© Outline This double-component product is acrylic acid polyester adhesive. It is easy and convenient to use for it solidifies...

high temperature resistant teflone adhesive
Specification: THO4096
Detail: Name High temperature resistant adhesive bonding fluorocarbon or eteline£¨THO4096£© Outline It is heterocyclic adhesive which cures fast when heated. it is temperature resistant and easy to operate. No bubbles appear after cu...

chips encapsulating adhesive
Specification: THO4054
Detail: Name High temperature resistant adhesives for the encapsulation of electronic components £¨THO4054£© Outline This double-component product is acrylic acid polyester adhesive. It is easy and convenient to use for it solidifies...


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